DSA00391818.pdf
by KOA Speer Electronics
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NETWORKS
TECHNOLOGY OF TOMORROW
THICK FILM R-NETWORKS
STANDARD SIP RKC
STRUCTURE
1 2 3 4 5 6 7 8 Ceramic substrate Pin connection Printed conductor (Ag, Pd) Resistive layer Glass layer Solder
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Original
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Unknown
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Unknown
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Unknown
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