DSAEDA000138341.pdf by Microsemi

Partial File Text GaAs Flip Chip PIN Diodes Â® TM MP6250 â P2715 Dimensions Size: 27.5 x 15 mils Thickness: 5 mils Bond Pad Size: 3.5 x 8.4 mils Features Low Capacitance (45 fF Typ.) Low Series Resi
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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