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    DSASW0012631.pdf by Freescale Semiconductor

    • Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor,
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    7313 28 pin AN2920 BGA cte bga thermal cycling reliability freescale ltcc Indalloy 181 ipc 610D LGA voiding ltcc chip NC-SMQ230 reflow profile FOR LGA COMPONENTS Requirements for Land Grid Array LGA Packages Solder Paste, Indium 5.1 AT Solder Paste, Indium 5.1, Type 3 Solder Paste, Indium, Type 3
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