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    DSA0036707.pdf by Motorola

    • Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc... PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts
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    User Tagged Keywords

    "exposed pad" PCB via 20-HSOP 48 pins, 7mm TQFP footprint LQFP-80 FREESCALE PACKING HSOP 48 Package HSOP-30 JEDEC JESD51-8 JEDEC qfn tray JEDEC-STD-020 JEDEC-STD020 jesd51 8 JESD51-2 JESD51-5 JESD51-8 LQFP 144 footprint lqfp 52 LQFP Package tray LQFP-48 footprint LQFP-64 footprint outline of the heat slug for JEDEC qfn 44 PACKAGE footprint 9mm surface mount package dimensions TQFP 144 PACKAGE Freescale tqfp 44 PACKAGE footprint

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