DSA008167.pdf by Hitachi Semiconductor

Partial File Text 1-1 CSP (Chip Scale Package) MCP (Multi Chip Package) FC (Flip Chip) (Packaging Co-Design) 1-2 LSI D
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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C7021 ED-4701 EE-13 EE13 JWG EE13 jwg2 JC-11 jedec package TFBGA 12 MIL-STD-750C military mcm cpu psi-celp SC47D SN 102 lcd tfbga TSOP 113 g

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