DSAHI00010323.pdf by Aries Electronics

Partial File Text Molded 27mm Center Probe Test Socket FEATURES: · For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. · Any pitch device on 0.50mm to 1.27mm. · Pressure mounting, no soldering
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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