DSA0038829.pdf by Intersil

Partial File Text PCB Land Pattern Design and Surface Mount Guidelines for QFN (MLFP) Packages ® Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction Genera
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IPC-SM-782 J-STD-001C J-STD-005 MARK RAY QFN MO-220 nozzle heater paste profile solder joint TB389