DSASW00106100.pdf by Altera

Partial File Text FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev Altera Corporation, San Jose, CA, USA abansal@altera.com ABS
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Pb Free Unknown
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4 MUD bga dye pry black pad F1020 FR4 1.6mm substrate FR4 substrate 1.6mm ipc 9702 IPC-9702 IPC9702 strain gage Strain gage report strain gage test strain Gages strain rate