DSASW00106127.pdf by Altera

Partial File Text Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang*, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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