DSASW00106537.pdf by Altera

Partial File Text Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera® devices. Package information includes the ordering code ref
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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148-PIN 1517-pin 165 BALL FBGA 208 pin rqfp drawing 240 pin rqfp drawing 311 3ag 3AG 311 ADV0812 ALTERA CROSS REFERENCE altera ep3 Altera EP4CE6 Altera pdip top mark BGA 176 ball package datasheet BGA and QFP Altera Package mounting bsc part 2 bt 151 600 cyclone III 484-pin BGA FPGA package D1 PGA 478 Device Name 23 330 DS-PKG-16 EP2AGX125 EP2AGX190 EP2AGX260 EP2AGX45 EP2AGX65 EP4CE ep4ce10 EP4CE115 EP4CE15 EP4CE22 EP4CE40 EP4CE55 EP4CGX50 EP610 epm7064s cross reference fbga -1932 FBGA 12 x 12 heat slug FBGA 12 x 19 package tray FBGA 1760 fBGA package tray fBGA package tray 12 x 19 FLEX 8000 Ordering Code HC335LF1152 HC4E25FF780 HC4E25WF484 JEDEC FBGA jedec package MO-247 led cross reference MS 034 MS-034 1152 BGA package information do 204 QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance QFN148 SOIC 20 pin package datasheet Theta JC of FBGA TQFP 144 PACKAGE TQFP 144 PACKAGE DIMENSION