DSAH00467111.pdf by Philips Semiconductors

Partial File Text INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I·CODE1 Label IC (IC with Bumps) Chip Specification Product Specification Revision 2.1 Public April 2000 Philips Semiconductors I·CODE1 Chip Specif
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ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE