DSA0013395.pdf by Intersil

Partial File Text Thermal Characterization of Packages for ICs Technical Brief December 1999 TB379.1 Author: Michael Colquitt Introduction Any operating semiconductor device will produce heat as a by-produ
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G30-88 JESD-51 JESD-51-1 JESD51 JESD51-1 JESD51-5 JESD51-7 TB379 thermal resistance standards