DSA003464.pdf by KOA Speer Electronics

Partial File Text RESISTORS TECHNOLOGY OF TOMORROW L FLAT CHIP BONDABLE THICK FILM RK73X t d W c c STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate Top termination (Ag Pd) Bottom termination (Ag Pd) Resis
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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