DSA003785.pdf
by KOA Speer Electronics
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NETWORKS
TECHNOLOGY OF TOMORROW
RESISTORS / CAPACITORS / DIODES
THIN FILM ON SILICON (TFOS) INTEGRATED PASSIVE COMPONENTS KPC
3 2 1
STRUCTURE
1 2 3 4 5 6 7 Die pad Silicon substrate Circui
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Original
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Unknown
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Unknown
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Unknown
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