DSA0015193.pdf by Hewlett-Packard

Partial File Text Schottky Barrier Chips for Hybrid Integrated Circuits Technical Data HSMS-0005/06 HSMS-8002/12 Features Description/Applications · Thermocompression/ Thermosonically Bondable · Gold Met
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Circuit integrated 8002 Hewlett-Packard microwave pin diode HSMS0005 HSMS8002 sn 8002