DSA0042004.pdf by Alliance Semiconductor

Partial File Text $GYDQFHLQIRUPDWLRQ $6&// ® 9.ð,QWHOOLZDWWORZSRZHU&02665$0 )HDWXUHV · Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II · Center power and ground pins for low noise · ESD
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