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DSA0042016.pdf
by Alliance Semiconductor
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$GYDQFHLQIRUPDWLRQ &// ® 9.ð,QWHOOLZDWWORZSRZHU&02665$0 )HDWXUHV · Smallest footprint packages - 48 ball FBGA - 400 mil 44-pin TSOP II · Center power and ground pins for low noise · ESD p
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Unknown
Pb Free
Unknown
Lifecycle
Unknown
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