DSA00394381.pdf by Motorola

Partial File Text The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603TM and PowerPC 604TM Microprocessors and MPC105 Bridge/Memory Con
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Coffin-Manson Equation IPC-SM-785 Modified Coffin-Manson Equation Calculations mpc 1414 MPC105 tce 1994 thermal analysis on pcb

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