DSARS002417.pdf by Maxim Integrated Products

Partial File Text Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLI
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APP1891 cte table flip chip substrate IPC 6012 ipc 7094 IPC-2221 IPC-2222 IPC-2223 IPC-2226 IPC-6011 IPC-6012 IPC-6013 IPC-6016 IPC-7094 IPC-7525 IPC-A-600 IPC-D-279 WLCSP flip chip WLCSP stencil design WLP 500