DSASW00186627.pdf

Partial File Text BCC and BCC++ The size and performance characteristics of Bump Chip Carrier (BCC) package make it well suited for RF devices, wide area networks, and DWDM systems. BCC is a molded, wire-bonded, lead
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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BCC-16 BCC24 BCC32 BCC92S Package 48 BCC