The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00186978.pdf
Partial File Text
WiMAX Promise of Quantum Leap in Broadband Wireless Communications Business Model Considerations George Wu Director of Marketing Technology Solutions and ASSP Fujitsu Microelectronics Americ
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
DSASW00186978.pdf
preview
Download Datasheet
User Tagged Keywords
3G HSDPA
802.16e wimax chip
mobi telecom
SoC, Network on Chip, telecom
WiMAX baseband
WiMAX wireless technology
zigbee wifi coexistence
Price & Stock Powered by