DSASW00187151.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold (B
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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256-pin Plastic BGA

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