DSASW00187161.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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