DSA0025144.pdf by Fujitsu

Partial File Text LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : QFN016-G-S250-1 Lead pitch 50mil Package width × package length 250 × 250mil Sealing method 16-pad ceramic LCC Fri
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC