DSASW00187169.pdf by Fujitsu

Partial File Text BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M10 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6×8 Sealing method Plastic mold (BGA
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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