DSA00167942.pdf by Texas Instruments

Partial File Text ASIC QRA / PROCESS & PACKAGE QUAL METHODOLOGY Design Libraries Specs Qual Cycle Time "GENERIC" QUALIFICATION Die Sizes Package Pincounts & Types Assembly Locations Wafer F
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F642790 TEXAS INSTRUMENTS, die attach TGB2000 TGC2000 TGC3000 wafer fab control wafer fab control plan