DASF0045765.pdf by Fairchild Semiconductor

Partial File Text AN-9048 Assembly Guidelines for Fairchild's 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This
Datasheet Type Original
RoHS Yes
Pb Free Yes
Lifecycle Transferred
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FDMF6704

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