DSAH00124360.pdf by Cooper Bussmann

Partial File Text ChipTM Fuses 3216FF Series, Fast-Acting HF FREE Ordering · Specify packaging and product code (i.e., TR/3216FF250-R) Soldering Method · Wave Immersion: 260°C, 10 sec max. · Infrared Reflow: 260°C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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