DASF0048095.pdf by Advanced Semiconductor Engineering

Partial File Text Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight (g): 2675.785 Provided By: Gerry Ala
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DASF0048095.pdf preview

Download Datasheet

User Tagged Keywords

2100a epoxy ABL-2100A G770* sumitomo G770* sumitomo composition G770J HSBGA HSBGA ase sac305 secret sumitomo epoxy VSC452XHW VSC452XHW-02