DSAZIHA2X00053357.pdf by Intersil

Partial File Text Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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