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    DSAZIHA2X00053426.pdf by Intersil

    • Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121A 121 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm pitch) (BSC) Rev 1, 2/14 5.526±0.030 X 0.500 Y 121x 0.
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