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    DSAZIHA2X00053434.pdf by Intersil

    • Plastic Packages for Integrated Circuits Package Outline Drawing W3x3.9D 3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WITH BSC) Rev 0, 1/14 X Y 1.410 ± 0.030 0.
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