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DSAZIHA2X00053434.pdf
by Intersil
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Plastic Packages for Integrated Circuits Package Outline Drawing W3x3.9D 3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WITH BSC) Rev 0, 1/14 X Y 1.410 ± 0.030 0.
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Original
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Unknown
Pb Free
Unknown
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