DSAZIHA2X00053460.pdf by Intersil

Partial File Text Plastic Packages for Integrated Circuits Package Outline Drawing W5x6.30A 5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) BSC Rev 0, 6/13 1.600 X Y 2.330Â±0.030 0.400 F E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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