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    DSAZIHA2X00053467.pdf by Intersil

    • Plastic Packages for Integrated Circuits Package Outline Drawing W6x7.42 42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm PITCH) Rev 0, 2/15 X Y 0.400 2.80 ±0.030 G 42x 0.265 ±
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