DSAZIHA2X00053473.pdf by Intersil
- Plastic Packages for Integrated Circuits Package Outline Drawing W8x8.64A 8x8 Array 64 Balls Wafer Level Chip Scale Package (WLCSP) 0.5mm Pitch (BSC) Rev 0, 7/14 X 4.025 ± 0.030 Y 0.5
- Original
- Unknown
- Unknown
- Unknown
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