DSARS009968.pdf by Amkor Technology

Partial File Text solution three-dimensional packages technology Through Silicon Via (TSV) Wafer Finishing & Flip Chip Stacking Through silicon via (TSV) interconnects are emerging to serve a wide range of 3
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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3D IC 3D IC TSV 3D-IC amkor Cu pillar amkor flip cu pillar FCCSP

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