DSASW00135395.pdf

Partial File Text PROCESS CP312 Power Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 70 x 70 MILS Die Thickness 9.0 MILS Base Bonding Pad Ar
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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