DSASW00135459.pdf by Central Semiconductor

Partial File Text PROCESS CPZ18 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 13.8 x 13.8 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 7.5
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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