DSASW00135460.pdf by Central Semiconductor

Partial File Text PROCESS CPZ19 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.7 x 17.7 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 11
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Active
Price & Stock
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Equivalent Parts !
Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

MMBZ5261B-G3-08 MMBZ5261B CMPZ5261BTR MMBZ5261B-HE3-18 MMBZ5261B

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CMPZ5235B CMPZ5261B CPZ19 Diode c 642 Zener diode zener diode chip zener wafer