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SCANUTA000202.pdf
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E 3 P a c k a rd APPLICATION NOTE 979 ; ' -4 ! { The Handling and Bonding of Beam Lead Devices Made Easy INTRODUCTION 8eam lead device s are p a rtic u la rly s u ite d fo r h yb rid i
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beam lead PIN diode
diod 4001
HPND-4001
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