DSAZIHA2X00062596.pdf by Micrel Semiconductor

Partial File Text Reportable Substances in Components Package Type : Component Weight : MLF(2X2mm Sawn) Document No : Lead #: 8 Process Type : No 1 Material Molding Compound Content in % 9.33% Conten
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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