DSAZIHA2X00062608.pdf by Micrel Semiconductor

Partial File Text Reportable Substances in Components Package Type : Component Weight : 0.0233 grams QFN33 (3.0mmx3.0mm) Lead #: No 1 16LD Material Content in % Molding Compound 46.46%
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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