DSAZIHA2X00062642.pdf by Micrel Semiconductor

Partial File Text Reportable Substances in Components Package Type : Component Weight : TSSOP (4.4mm Body) Document No : Lead #: 16 Process Type : No 1 Material Molding Compound Content in % 48.85% C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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