DSASW00209014.pdf by Infineon Technologies

Partial File Text P-FTM8-2-1 Ultrathin Wire Bond Mold Package For contactless application (Controller) Sh o rt Pro d u c t O ve r vi e w May 2010 Ch i p C a rd & Se c u ri t y P-FTM8-2-1 P-FTM8-2-1 Sh
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
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iso 10373-1 ISO/IEC 7810

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