DSASW00209019.pdf by Infineon Technologies

Partial File Text P-M5.1 Wire Bond Mold Package For contact based application (Controller) Short Product Overview May 2010 Chip Card & Security P-M5.1 P-M5.1 Short Product Overview Ref.: Chip_Card_
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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