DSASW00209074.pdf by Infineon Technologies

Partial File Text P-MCC2-2-1 Wire Bond Mold Package For contactless application (Memory) Sh o rt Pro d u c t O ve r vi e w May 2010 Ch i p C a rd & Se c u ri t y P-MCC2-2-1 P-MCC2-2-1Short Product Ove
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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