DSAE007690.pdf by Hittite Microwave

Partial File Text v00.0902 S8 (E) 8 LEAD PLASTIC SOIC PACKAGE PACKAGE OUTLINES S8 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DI
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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SOIC 8 pcb pattern

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