DSA2H002837.pdf by Aries Electronics

Partial File Text MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: · Solderless spring probes pressure mount to the test board and device solderball or pad. · Only .077" (1.95mm)
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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