DSA2H003038.pdf by Aries Electronics

Partial File Text 20-301590-10 REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: · Allows placing an SOIC (narrow body) on a board laid out for an SOWIC (wide body). · Solder
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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