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DSA2H003063.pdf
by Aries Electronics
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CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: · For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. · Any dev
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micro pitch BGA